Ball Wire Bonding Machine - List of Manufacturers, Suppliers, Companies and Products

Tabletop Ball Wire Bonding Device 'iBond5000'

Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

This product is an advanced tabletop ball wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It comes standard with ESD coating and is suitable for R&D and small-scale production. By using only the minimum necessary parameters, it allows for easy adjustment of bonding parameters. 【Features】 ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height enhances flexibility ■ Compatible with copper wire bonding * You can download the product documentation (PDF) from below. * If you have any questions about the product or require support after installation, please feel free to contact the person in charge below.